Application field
Chip Packaging
Semiconductor substrate - the core support for chip packaging, empowers power devices, RF chips, advanced packaging (SiP/Chiplets) and other scenarios with high thermal conductivity, low loss, excellent compatibility, and precise size control, laying a reliable foundation for chip heat dissipation, signal transmission, and structural integration, and helping to upgrade packaging efficiency and device performance.
Please feel free to call us for further discussion and enquiries.
Address: Yuelu District, Changsha City, Hunan Province
Contact: Manager Yu
Mobile Phone155-3970-1757
188-1718-3668
E-mail：yulan@lanxinwafer.com
Store URL：Home - Lanxin Semiconductor - Taobao
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